The diffusion bonding procedure. In-between the two OO3 and this interface layer, it is achievable to observe a thin layer ( 1 ) composed of alternated different grey layer, it truly is probable to observe a thin layer (1 ) composed of alternated distinct grey columnar compact grains. However, it it was not probable to perform EDS analyses owingits columnar compact grains. Nonetheless, was not possible to perform EDS analyses owing to to decreased thickness. its decreased thickness.(a)(b)(c)Figure six. SEM photos from the joints with thin film interlayer processed at at (a) C for 60 (b) (b) C for 10 min, and Figure 6. SEM pictures of your joints with Ti Ti thin film interlayer processed(a) 950 950for 60 min,min,1000 1000 for ten min, and (c) C for 60 min. min. (c) 1000 1000 forIncreasing the bonding time at 1000 C to 60 min promotes the modify within the Polmacoxib Autophagy thickness Increasing the bonding time at 1000 to 60 min promotes the alter within the thickof the layers that compose the interface. This interface is often observed in Figure 6c. The ness on the layers that compose the interface. This interface may be observed in Figure 6c. increase in the bonding time results in the lower in the -Ti phase and the growth of your The raise in the bonding time results in the lower within the -Ti phase and the development Ti3 Al layer with TiAl particles close to Al2 O3 (Z4 in Figure 6c). on the Ti3Al layer with TiAl particles close to Al2O3 (Z4 in Figure 6c). The confirmation from the phases in the interfaces was performed by EBSD, which The confirmation from the phases at the interfaces was conducted by EBSD, which alallows Kikuchi Sutezolid In stock patterns of tiny zones to be obtained due to the reduced interaction volume. lows Kikuchi patterns of tiny zones to become obtained as a consequence of the decreased interaction volume. Figure 7 shows EBSD Kikuchi patterns on the joint processed at 1000 C for 60 min. This Figure 7 shows EBSD Kikuchi patterns of your joint processed at 1000 for 60 min. This method was of paramount value to confirm the presence in the -TiAl intermetallic phase close for the Al2 O3 base material.technique was of paramount significance to confirm the presence of the -TiAl intermetallic phase close to the Al2O3 base material.Metals 2021, 11,Table 1. Chemical composition obtained by EDS of your zones in Figure 6.9 ofElement (at. ) Table 1. Chemical composition obtained by EDS from the zonesV Figure six. in Ti Al 1 88.5 ten.three 1.two Element (at. ) Zone Situations 2 88.3 ten.three 1.five Ti Al V 3 76.five 22.five 1.0 950 /60 min 1 88.five 10.three 1.two 80.3 six.7 10.3 13.0 24 88.3 1.5 35 76.5 1.0 950 C/60 min 65.1 33.722.5 1.2 4 80.three 6.7 13.0 1 86.8 11.6 1.6 5 65.1 33.7 1.2 two 73.3 19.7 7.0 1 86.eight 11.six 1.six 1000 /10 min 86.0 11.919.7 2.1 23 73.three 7.0 C/10 min 1000 34 86.0 two.1 75.0 25.011.9 4 75.0 25.0 1 88.three 11.7 12 88.three 77.1 6.9 11.7 16.0 2 77.1 6.9 16.0 1000 /60 min C/60 min 1000 74.five 25.525.5 33 74.five 44 57.6 57.6 42.442.4 Circumstances Zone–not detected. –not detected.Possible Phases -TiPossible Phases -Ti2-Ti3Al -Ti -Ti -Ti -Ti3 Al 2-Ti3Al2 -TiAl -Ti -Ti 2 -Ti3 Al -TiAl -Ti -Ti -Ti -Ti -Ti 2-Ti3Al two -Ti3 Al -Ti -Ti -Ti -Ti 2-Ti3Al 2 -Ti3 Al 2 -Ti3 -TiAl 2-Ti3AlAl -TiAl(b)2(a)(c)Figure 7. (a) SEM 7. (a) SEM photos on the interface produced with Ti thin film processed at 1000for 60 min, (b)(b) EBSD Kikuchi Figure pictures of your interface produced with Ti thin film processed at 1000 C for 60 min, EBSD Kikuchi patterns of your grain marked asof the(a) indexed asas 1 in (a)and (c) EBSD Kikuchi patterns from the g.
